HiETA has established the local limits for powder removal over a range of fine-feature geometries. These are then combined with strategies for the global removal of powder for large components with tortuous internal architectures.

HiETA is currently developing methods for tracking and confirming the successful removal of powder from devices.

Materials: All powder materials including CM247LC, Inconel 718 & 625, 316, Ti6Al4V, AlSi10Mg

Application: Removal of powder for parts manufactured with Laser Powder Bed Additive Manufacturing

TRL for application: 8

Key features: Proprietary capabilities for removing powder from narrow ducts and complex internal architectures